发明名称 |
OPTICAL SENSOR ARRANGEMENT AND METHOD OF PRODUCING AN OPTICAL SENSOR ARRANGEMENT |
摘要 |
An optical sensor arrangement, in particular an optical proximity sensor arrangement comprises a three-dimensional integrated circuit further comprising a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit. The driver circuit is electrically connected to the light-emitting device and to the light-detector to control the operation of the light-emitting device and the light-detector. A mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector. |
申请公布号 |
US2016306042(A1) |
申请公布日期 |
2016.10.20 |
申请号 |
US201415101893 |
申请日期 |
2014.12.03 |
申请人 |
AMS AG |
发明人 |
SCHRANK Franz;DIERSCHKE Eugene G.;SCHREMS Martin |
分类号 |
G01S17/02;H01L27/144;H01L25/16;H01L31/0216;H01L31/0232;H01L31/173;H01L31/02 |
主分类号 |
G01S17/02 |
代理机构 |
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代理人 |
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主权项 |
1. An optical sensor arrangement, in particular an optical proximity sensor arrangement, comprising a three-dimensional integrated circuit further comprising:
a first layer comprising a light-emitting device, a second layer comprising a light-detector and a driver circuit electrically connected to the light-emitting device and to the light-detector and configured to control the operation of the light-emitting device and the light-detector and wherein the second layer comprises a second light barrier further comprising through silicon vias designed into the substrate, and a mold layer comprising a first light-barrier between the light-emitting device and the light-detector configured to block light from being transmitted directly from the light-emitting device to the light-detector. |
地址 |
Unterpremstäetten AT |