LED PACKAGE STRUCTURE

摘要

An LED package structure includes a base, an LED chip disposed on the base, at least one metal wire, a phosphor sheet, and an encapsulation resin disposed in the base and encapsulating the LED chip, the metal wire, and the phosphor sheet. The LED chip has at least one electrode thereon. The metal wire has an apex and a loop height being defined by the apex. The metal wire is electrically connected to the electrode and the base. The phosphor sheet includes a B-stage resin and a plurality of phosphor powders mixed therewith. The phosphor sheet is adhered to the LED chip by the B-stage resin capable of viscosity and covers the top surface, the side surface, and the electrode of the LED chip. A thickness of the phosphor sheet is smaller than the loop height, and the apex of the metal wire is exposed from the phosphor sheet.

主权项

1. An LED package structure, comprising:
a base; an LED chip having at least one electrode thereon and being disposed on the base, the LED chip including a top surface, a bottom surface, and a side surface arranged between the top surface and the bottom surface; at least one metal wire having an apex and a loop height being defined by the apex, two opposite ends of the at least one metal wire being respectively and electrically connected to the at least one electrode of the LED chip and the base; a first phosphor sheet including a B-stage resin and a plurality of phosphor powders being mixed therewith, the first phosphor sheet being adhered to the LED chip by the B-stage resin capable of viscosity and covering the top surface, the side surface, and the at least one electrode of the LED chip, wherein a thickness of the first phosphor sheet is smaller than the loop height, and the apex of the at least one metal wire is exposed from the first phosphor sheet; and an encapsulation resin disposed in the base and encapsulating the LED chip, the at least one metal wire, and the first phosphor sheet.