发明名称 |
Optical wiring substrate, manufacturing method of optical wiring substrate and optical module |
摘要 |
An optical wiring substrate includes an insulation layer including a resin, a first conductor layer formed on the insulation layer and including a metal, the first conductor layer including an inclined surface that is inclined relative to an optical axis of an optical fiber. The insulation layer further includes an end surface that faces a cladding of the optical fiber. The inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber. |
申请公布号 |
US9529163(B2) |
申请公布日期 |
2016.12.27 |
申请号 |
US201414200297 |
申请日期 |
2014.03.07 |
申请人 |
Hitachi Metals, Ltd. |
发明人 |
Ishikawa Hiroshi;Hirano Kouki;Yasuda Hiroki |
分类号 |
G02B6/12;G02B6/42;H05K3/06;H05K3/00 |
主分类号 |
G02B6/12 |
代理机构 |
Roberts Mlotkowski Safran Cole & Calderon, PC |
代理人 |
Roberts Mlotkowski Safran Cole & Calderon, PC |
主权项 |
1. An optical wiring substrate, comprising:
an insulation layer comprising a resin; a first conductor layer formed on one side of the insulation layer and comprising a metal, the first conductor layer comprising an inclined surface that is inclined relative to an optical axis of an optical fiber, a second conductor layer formed on an opposite side of the insulation layer and comprising a metal, the second conductor layer supporting the optical fiber, wherein the insulation layer further comprises an end surface that faces a cladding of the optical fiber, and wherein the inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber. |
地址 |
Tokyo JP |