发明名称 Optical wiring substrate, manufacturing method of optical wiring substrate and optical module
摘要 An optical wiring substrate includes an insulation layer including a resin, a first conductor layer formed on the insulation layer and including a metal, the first conductor layer including an inclined surface that is inclined relative to an optical axis of an optical fiber. The insulation layer further includes an end surface that faces a cladding of the optical fiber. The inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber.
申请公布号 US9529163(B2) 申请公布日期 2016.12.27
申请号 US201414200297 申请日期 2014.03.07
申请人 Hitachi Metals, Ltd. 发明人 Ishikawa Hiroshi;Hirano Kouki;Yasuda Hiroki
分类号 G02B6/12;G02B6/42;H05K3/06;H05K3/00 主分类号 G02B6/12
代理机构 Roberts Mlotkowski Safran Cole & Calderon, PC 代理人 Roberts Mlotkowski Safran Cole & Calderon, PC
主权项 1. An optical wiring substrate, comprising: an insulation layer comprising a resin; a first conductor layer formed on one side of the insulation layer and comprising a metal, the first conductor layer comprising an inclined surface that is inclined relative to an optical axis of an optical fiber, a second conductor layer formed on an opposite side of the insulation layer and comprising a metal, the second conductor layer supporting the optical fiber, wherein the insulation layer further comprises an end surface that faces a cladding of the optical fiber, and wherein the inclined surface of the first conductor layer is formed at a position that faces a core of the optical fiber.
地址 Tokyo JP