Current sensor

摘要

A current sensor comprises a housing of plastic, a current conductor with integrally shaped first and second electrical terminals, through which a current to be measured is supplied and discharged, third electrical terminals, and a semiconductor chip having at least one magnetic field sensor, which is sensitive to a component of the magnetic field generated by the current flowing through the current conductor running perpendicularly to the surface of the semiconductor chip. The first and second electrical terminals are arranged at a first side of the housing, the third electrical terminals are arranged at a side of the housing opposite to the first side. The semiconductor chip is mounted as flip chip. The semiconductor chip comprises first bumps, which make electrical connections to the third terminals, and second bumps located above the current conductor and electrically separated from the semiconductor chip by an isolation layer.

主权项

1. Current sensor, comprising
a housing of plastic, a current conductor through which a current to be measured is supplied and discharged, a semiconductor chip having an active surface with at least one magnetic field sensor, which is sensitive to a component of a magnetic field generated by the current flowing through the current conductor running perpendicularly to the active surface of the semiconductor chip, wherein the current conductor has three sections forming a U-shape, namely a first section which comprises integrally shaped first electrical terminals, a second elongated section with parallel edges, and a third section which comprises integrally shaped second electrical terminals, the first and second electrical terminals are arranged at a first side of the housing, third electrical terminals are arranged at a side of the housing opposite to the first side, the semiconductor chip is arranged with respect to a longitudinal axis of the second section of the current conductor such that the semiconductor chip protrudes over the parallel edges of the second section of the current conductor in an approximately symmetrical manner, a first edge of the semiconductor chip projecting beyond one of the parallel edges of the second section, and a second edge of the semiconductor chip opposite the first edge projecting beyond the other of the parallel edges of the second section; the active surface of the semiconductor chip faces the current conductor, first bumps are located close to the first edge of the semiconductor chip and second bumps are located close to the second edge of the semiconductor chip, the first bumps are located on the third electrical terminals to provide electrical connection to electrical connection surfaces of the semiconductor chip, and the second bumps are located on the current conductor or on projections of the current conductor and electrically separated from the semiconductor chip by an isolation layer.