| 摘要 |
<p>A semiconductor device in which the adhesion between the wiring pattern and a resin is improved. The semiconductor device has a film piece (14) having a wiring pattern (16) which is patterned including projecting sections (17), a semiconductor chip (12) the electrodes (13) of which are bonded to the projecting sections (17), and a resin (19) which is provided on the pattern in the area other than the projecting section (17). The surface of contact of the wiring pattern (16) with the resin (19) is roughened.</p> |
