| 摘要 |
A method of manufacturing an implantable electrode using a mold having a chamber with a compressible interior surface portion. Encapsulant and a conductive lead are placed into the chamber, and the mold is closed. With the mold closed, the compressible interior surface portion of the mold is biased against the lead at a region of contact with the lead, such that the biasing squeezes or excludes any encapsulant from between the lead and the mold at the region of contact. The electrode may have a body having an active portion with a smoothly contoured surface. The active portion may include a conductive wire partially embedded in an electrically insulative encapsulant, with the surface of the active portion comprising a major insulative surface portion defined by the surface of the encapsulant, and a plurality of curved conductive surface portions defined by exposed portions of the surface of the wire. Each of the conductive surface portions may have a perimeter bounded by a skirt portion of the insulative surface portion, and each skirt portion may be a smoothly curved transition between the insulative surface portion and the respective conductive surface portion, such that there are no sharp or rough grooves, angles, or edges on the active portion.
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