| 摘要 |
PURPOSE: A coating method of photosensitive film is provided, which forms the photosensitive film to drop photosensitive solution for antireflective coating on the wafer in the condition of stopping the wafer. Therefore, it prevents damage of board at the etching plasma by minimizing the formation of bubble that is generated by mixing photosensitive solution and air by the change of the air current. CONSTITUTION: The coating method contains the steps of; (1) dropping photosensitive solution for antireflective coating on the wafer in the condition of stopping the wafer; and (2) rotating the wafer after spraying the photosensitive solution for antireflective coating on the surface of the wafer. |
