Wafer on wafer packaging and method of fabrication for full-wafer burn-in and testing

摘要

A semiconductor device wafer-on-support wafer package comprising a plurality of segmentable chip-scale packages and method of constructing, burning-in, and testing same. The wafer-on-wafer package can be burned-in and tested at the wafer level prior to segmenting, or singulating, the wafer-on-wafer package into a plurality of individual chip-scale packages. The device wafer includes a plurality of unsingulated semiconductor dies having a plurality of die bond pads being respectively bonded to a plurality of electrically conductive die bond pad connect elements provided on a first surface of the support wafer.