发明名称 |
Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device |
摘要 |
A wiring pattern formation method in which a wiring pattern is formed by arranging, in a region which is demarcated by a partition wall, liquid material which includes an electrically conductive material, including: arranging a resin material around the periphery of a region upon which the wiring pattern is to be formed; imparting liquid affinity to a demarcated region which has been demarcated by the resin material; narrowing down the demarcated region by flowing out the resin material towards and into the demarcated region; and forming the partition wall by curing the resin material.
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申请公布号 |
US2006127567(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
US20050235634 |
申请日期 |
2005.09.26 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
UEHARA NOBORU;SHINTATE TSUYOSHI;SAKURADA KAZUAKI |
分类号 |
C23C26/00;H01L21/4763;H01L23/52 |
主分类号 |
C23C26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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