发明名称 INTEGRATED CIRCUIT MEMORY SYSTEM EMPLOYING SILICON RICH LAYERS
摘要 An integrated circuit memory system [100] that includes: providing a substrate [102]; forming a silicon rich charge storage layer [204] over the substrate [102]; forming a first isolation trench [400] through the silicon rich charge storage layer [204] in a first direction [900]; and forming a second isolation trench [800] through the silicon rich charge storage layer [204] in a second direction [902].
申请公布号 WO2008016514(A2) 申请公布日期 2008.02.07
申请号 WO2007US16620 申请日期 2007.07.24
申请人 ADVANCED MICRO DEVICES, INC.;SPANSION LLC;JOSHI, AMOL, RAMESH;SACHAR, HARPREET;SUH, YOUSEOK;FANG, SHENQING;YANG, CHIH-YUH;SINGH, LOVEJEET;SHIRAIWA, HIDEHIKO;CHANG, KUO-TUNG;BELL, SCOTT, A.;HOLBROOK, ALLISON;TORII, SATOSHI;MATSUMOTO, DAVID, H. 发明人 JOSHI, AMOL, RAMESH;SACHAR, HARPREET;SUH, YOUSEOK;FANG, SHENQING;YANG, CHIH-YUH;SINGH, LOVEJEET;SHIRAIWA, HIDEHIKO;CHANG, KUO-TUNG;BELL, SCOTT, A.;HOLBROOK, ALLISON;TORII, SATOSHI;MATSUMOTO, DAVID, H.
分类号 H01L21/8247;H01L21/336;H01L21/762;H01L27/115 主分类号 H01L21/8247
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