Bonding apparatus and method for display device

摘要

A bonding apparatus for a display device includes a film bonding device configured to attach an anisotropic conductive film to a panel, and a pressure device configured to bond a driving chip and a flexible printed circuit to the panel. The pressure device includes a pressure head including a heat source, a pressure tip attached to a bottom side of the pressure head and the pressure tip being configured to press the flexible printed circuit to the panel, and a transfer unit attached to an upper side of the pressure head, the transfer unit being configured to transfer the pressure head. The heat source is located in the pressure head.

主权项

1. A bonding apparatus for a display device, the bonding apparatus comprising:
a film bonding device configured to attach an anisotropic conductive film to a panel; and a pressure device configured to bond a driving chip and a flexible printed circuit to the panel, wherein: the pressure device includes:
a pressure head including a heat source, the heat source being located in the pressure head,a pressure tip attached to a bottom side of the pressure head, the pressure tip being configured to press the flexible printed circuit to the panel, anda transfer unit attached to an upper side of the pressure head, the transfer unit being configured to transfer the pressure head,wherein the heat source is located over the pressure tip, and is disposed at a position biased toward one side of the transfer unit with reference to a center axis of the transfer unit, and the pressure tip is located on a center axis of the transfer unit.