Semiconductor device and semiconductor device connection structure

摘要

In a semiconductor device, heat radiation plates are respectively disposed on a front surface side and a rear surface side of semiconductor chips in an upper arm and a lower arm. A lead-out conductor part includes a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and an insulating film disposed between the positive electrode terminal and the negative electrode terminal, and the positive electrode terminal and the negative electrode terminal are disposed oppositely while sandwiching the insulation film. The semiconductor chips are covered by a resin mold part, surfaces of the heat radiation plates opposite to the semiconductor chips, a part of the positive electrode terminal, and a part of the negative electrode terminal are exposed from the resin mold part, and at least a part of the parallel conductor in the lead-out conductor part enters the resin mold part.

主权项

1. A semiconductor device comprising:
an upper arm and a lower arm each including a semiconductor chip in which a semiconductor switching element is formed, the semiconductor chip having a front surface and a rear surface; heat radiation plates respectively disposed on a front surface side and a rear surface side of the semiconductor chip in each of the upper arm and the lower arm; a lead-out conductor part including a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and an insulating film, the positive electrode terminal connected to the heat radiation plate connected to a positive electrode side of the semiconductor chip in the upper arm, the negative electrode terminal connected to the heat radiation plate connected to a negative electrode side of the semiconductor chip in the lower arm, the insulation film disposed between the positive electrode terminal and the negative electrode terminal, the positive electrode terminal and the negative electrode terminal disposed oppositely while sandwiching the insulation film; and a resin mold part configured in such a manner that the resin mold part covers the semiconductor chips while exposing surfaces of the heat radiation plates opposite to the semiconductor chips, a part of the positive electrode terminal, and a part of the negative electrode terminal, and at least a part of the parallel conductor in the lead-out conductor part enters the resin mold part.