Thick film conductive inks for electronic devices

摘要

Thick film conductive inks for electronic devices, methods for making electronic devices using thick film conductive inks, and electronic devices fabricated by such methods are provided herein. In one example, a thick film conductive ink includes an organic portion and an inorganic portion. The inorganic portion is dispersed in the organic portion to define a paste. The inorganic portion includes metallic copper powder, cupric oxide, and elemental boron. The thick film conductive ink includes substantially no glass.

主权项

1. A thick film conductive ink for an electronic device, the thick film conductive ink comprising:
an organic portion; and an inorganic portion dispersed in the organic portion defining a paste, wherein the inorganic portion comprises metallic copper powder, cupric oxide, and elemental boron, and wherein the thick film conductive ink comprises substantially no glass, wherein the metallic copper powder comprises a first copper powder, a second copper powder, and/or a third copper powder, wherein the first copper powder has a first average surface area of from about 0.3 to about 0.8 m2/g, the second copper powder has a second average surface area of from about 0.8 to about 1.5 m2/g, and the third copper powder has a third average surface area of from about 1.5 to about 2.5 m2/g, and wherein the metallic copper powder comprises the first copper powder that has a median particle size of about 4.5 to about 10.5 μm.