Printed circuit board and method for manufacturing same

摘要

A printed circuit board according to an embodiment of the present invention includes an insulating layer, a pad formed on the insulating layer and exposed through an opening section of a solder resist, a bump formed by filling an opening portion of the solder resist from top of the pad and having an narrow width than the opening of the solder resist.

主权项

1. A printed circuit board comprising;
an insulating layer; a pad formed on the insulating layer; a solder resist formed on the pad and having an opening section exposing an upper surface of the pad; a bump connection section on the pad and filling the opening section of the solder resist; a plating seed layer between an inner wall of the solder resist and a side surface of the bump connection section; and a bump formed on the bump connection section, having a first portion protruded from an upper surface of the solder resist at a predetermined height, wherein the first portion of the bump has a narrower width than the opening section of the solder resist.