Flip chip light emitting diode packaging structure

摘要

A flip chip light emitting diode (LED) packaging structure, including a substrate, an LED chip including a P electrode and a N electrode. A protruding platform is formed in a center of the substrate. The protruding platform includes a first connecting portion and a second connecting portion electrically insulating from each other. The P electrode and the N electrode is conductively fixed to the protruding platform by solder, and a bottom edge of the P electrode and the N electrode are beyond a top edge of the protruding platform.

主权项

1. A flip chip light emitting diode (LED) structure comprising:
a substructure having a first side and a second side opposite the first side, with a protruding platform extending out from the first substrate side; and a light emitting diode supported by, and coupled to, the protruding platform, the light emitting diode having a P electrode and an N electrode; wherein, the protruding platform has a top surface with a first edge and a second edge opposite the first edge, a first connecting portion along the first edge, a second connecting portion along the second edge and an insulating portion electrically insulating the first connecting portion from the second connecting portion; wherein, the P electrode rests on a portion of the top protruding platform surface with a portion of the P electrode extending away from the first top surface edge and the P electrode is electrically connected to the first connection portion; and wherein, the N electrode rests on a portion of the top protruding platform surface with a portion of the N electrode extending away from the second top surface edge and the N electrode is electrically connected to the second connection portion.