Chip separation process for photochemical component printing

摘要

Parallel transfers of components from donor plates to chip modules can be performed with a single alignment step, after arranging the components to have the correct lateral positions. For example, a dimension of the chip module can be separated to be an integer multiple of a period of the component array on the donor plates.

主权项

1. A method comprising
providing a first donor plate, wherein the first donor plate comprises multiple chips arranged in a first array on a surface of the first donor plate, wherein the first array comprises a first period; providing a second donor plate, wherein the second donor plate comprises a first layer of a photoactivated thermal transfer material; simultaneously transferring the multiple chips from the first donor plate to the second donor plate, wherein the multiple chips are transferred to a second array on a second layer, wherein the second array comprises a second period, wherein the second period is different from the first period.