| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module excellent in connection reliability even under a high temperature environment.SOLUTION: A semiconductor module according to the present embodiment comprises: a substrate having a wiring layer; a semiconductor element which is mounted on the substrate and has an electrode on a surface; and a conductive plate bonded to the electrode of the semiconductor element via a sintered metal layer. The electrode on the surface of the semiconductor element is divided into a plurality of electrodes by gate wiring parts which are inactive areas, and in the sintered metal layer, a sintered density of regions on the inactive areas is lower than that of the other regions.SELECTED DRAWING: Figure 4 |
