| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which forms a flat horizontal surface at an edge part of a substrate such as a wafer.SOLUTION: A polishing device polishes an edge part of each substrate and includes: a wafer holding part which holds and rotates a substrate W; a pressing pad 51 which presses a polishing tape 38 to an edge part of the substrate W; and a tangential direction movement mechanism 30 which is connected with the pressing pad 51 and moves the pressing pad 51 in a tangential direction of the substrate W. The structure reduces a contact area between an outer side area of the substrate edge part and the polishing tape 38 without changing a contact area between an inner side area of the substrate edge part and the polishing tape 38 and forms a flat horizontal surface at the substrate edge part.SELECTED DRAWING: Figure 2 |
