| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrically conductive particle manufacturing method capable of forming a homogeneous metal layer on particles to be filmed, without agglomerating the particles during the formation of the metal layer.SOLUTION: A sputtering target 22 made of a metallic material is used to form a metal layer 12 by sputtering on the surfaces of particles 11 to be filmed, thereby manufacturing electrically conductive particles 10. In the method for manufacturing the electrically conductive particles 10, when the metal layer 12 is formed, sputtering is intermittently performed while vibrating a vibration container 25 arranged with the particles 11 to be filmed. In the electrically conductive particle manufacturing method, it is preferred to alternately repeat a step of performing sputtering for 1 to 60 minutes and a step of not performing sputtering for 1 to 15 minutes, one or more times for each step.SELECTED DRAWING: Figure 1 |
