发明名称 TIN OXIDE SPUTTERING TARGET AND METHOD FOR MAKING THE SAME
摘要 A tin oxide sputtering target includes uniformly mixed elemental Sn and SnO2. An atomic ratio of Sn atoms and O atoms in the tin oxide sputtering target satisfies 1:2<Sn:O≦2:1. A method for making a tin oxide sputtering target includes steps of: providing Sn powder and SnO2 powder; mixing the Sn powder and the SnO2 powder to form a mixture, an atomic ratio of Sn atoms and O atoms in the mixture satisfies 1:2<Sn:O≦2:1; and press-molding and sintering the mixture to obtain a tin oxide sputtering target, the sintering is performed in an inert atmosphere.
申请公布号 US2016326634(A1) 申请公布日期 2016.11.10
申请号 US201514842217 申请日期 2015.09.01
申请人 Tsinghua University ;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 ZHUANG DA-MING;ZHAO MING;GUO LI;CAO MING-JIE;LI XIAO-LONG;SUN RU-JUN
分类号 C23C14/34;C04B35/457 主分类号 C23C14/34
代理机构 代理人
主权项 1. A tin oxide sputtering target comprising: uniformly mixed elemental Sn and SnO2; wherein an atomic ratio of Sn atoms and O atoms in the tin oxide sputtering target satisfies 1:2<Sn:O≦2:1.
地址 Beijing CN