| 摘要 |
PROBLEM TO BE SOLVED: To simplify a gate balance in injection molding, to disuse a manifold of a hot runner, to shorten whole length of a cold runner, and to simplify a structure of a die.SOLUTION: A resin injection molding device 1 comprises a control circuit 100 for individually performing condition setting on respective heating cylinders 4a-4c, the condition setting containing measurement setting of a molten resin injected from each of the heating cylinders 4a-4c, injection setting for injecting the molten resin, temperature setting of the molten resin, and operation condition setting of each of nozzles 7a-7c, and respectively outputting a control signal to the heating cylinders 4a-4c and molding die 2 so as to satisfy the condition setting.SELECTED DRAWING: Figure 6 |
