发明名称 Apparatus and method for spin coating wafers and the like
摘要 An apparatus and method are provided for controlling the rate of drying of a high-viscosity chemical applied to a substantially flat surface of a spinning article. The rate of drying of the chemical is controlled by controlling the saturation level of a solvent in the local atmosphere in which the article is spinning, i.e., in the air space adjacent to the surface of the article. By spinning the article in a solvent-laden vapor, the evaporation of solvent from the chemical is slowed and therefore the rate at which the chemical dries and thickens is also slowed. Spreading of the chemical may also be facilitated and premature drying of the chemical may be avoided by applying to the surface of the article a thin layer of the solvent prior to application of the chemical.
申请公布号 US5472502(A) 申请公布日期 1995.12.05
申请号 US19930114820 申请日期 1993.08.30
申请人 SEMICONDUCTOR SYSTEMS, INC. 发明人 BATCHELDER, WILLIAM T.
分类号 G03F7/16;B05D1/00;H01L21/00;H01L21/027;(IPC1-7):B05C11/02 主分类号 G03F7/16
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