| 摘要 |
A two-layer multi-wire connecting socket structure is disclosed. It comprises a housing, a socket body, a plurality of pin seats arranged as an upper layer and a lower layer, and a pin package lid. The socket body has a plurality of through-holes arranged as an upper row and a lower row for receiving the upper layer and lower layer pin seats, respectively. The pin seat is formed as a generally L-shaped plastic member with a plurality of pins embedded therein. For each of the pins, one end thereof is bent to form a slanting terminal for contacting with a plug, and another end thereof is projecting outside of the plastic member for engaging with a PC board. The pin package lid covers one side of the socket body to allow the projecting pins to be securely spaced and aligned. The connecting socket structure so disclosed has the advantage of achieving smooth operation when a socket is inserted into a PC board. The two-layer structure also saves space on the PC board. Furthermore, the embedded pins in the pin seats cause the interfering noise signals from the outside to be substantially reduced.
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