发明名称 Tapered electrode for stacked capacitors
摘要 A method for forming a stacked capacitor includes the steps of providing a first insulating layer having a conductive access path therethrough, forming a second insulating layer on the first insulating layer, forming a trench in the second insulating layer, the trench having tapered sidewalls, forming a first electrode in the trench and on the trench sidewalls, the first electrode being electrically coupled to the conductive access path, forming a dielectric layer on the first electrode and forming a second electrode on the dielectric layer. A stacked capacitor having increased surface area includes a first electrode formed in a trench provided in a dielectric material. The first electrode has tapered surfaces forming a conically shaped portion of the first electrode, the first electrode for accessing a capacitively coupled storage node.
申请公布号 US6165864(A) 申请公布日期 2000.12.26
申请号 US19980123298 申请日期 1998.07.28
申请人 SIEMENS AKTIENGESELLSCHAFT;IBM 发明人 SHEN, HUA;NUETZEL, JOACHIM;RADENS, CARL J.;KOTECKI, DAVID
分类号 H01G4/12;H01L21/02;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L21/20 主分类号 H01G4/12
代理机构 代理人
主权项
地址