WAFER HOLDER FOR SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING DEVICE IN WHICH IT IS INSTALLED

摘要

Wafer holder for semiconductor manufacturing and semiconductor manufacturing equipment in which the holder is installed, wherein films may be deposited uniformly over the entire surface of wafers and the generation of particles is slight. In the wafer holder, which has a wafer-carrying surface, the form of an RF power-generating electrode circuit formed in the wafer holder is round, and by making the circuit diameter 90% or more of the diameter of wafers that the wafer holder carries, wafer holders and semiconductor manufacturing equipment with which films whose thickness distribution is uniform are deposited can be realized. Alternatively, rendering the distance between the periphery of the RF-generating electrode circuit and the periphery of the wafer holder longer than the distance separating the electrode circuit from the wafer-carrying surface enables the realization of wafer holders and semiconductor manufacturing equipment wherein the generation of particles is slight.