| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card having excellent appearance and high durability, and an IC card. <P>SOLUTION: In this method for manufacturing an IC card by forming a concave 21 for embedding an IC module at a card base body, and hot-pressing and mounting the IC module on the concave for embedding the IC module, a thin groove d for releasing expanded air generated when the IC module is heated and mounted on the surface of the first concave of the concave for embedding the IC module is formed so as to be communicated from the outer circumference of the first concave to the second concave. The IC card is manufactured by forming the concave for embedding the IC module at the card base body, and hot-pressing and mounting the IC module on the concave for embedding the IC module, and the thin groove d is formed so as to be communicated from the outer circumference of the first concave to a second concave 212 on the surface of the first concave 211 of the concave for embedding the IC module. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
