DIE HOLDING ASSEMBLY, FABRICATION OBJECT HOLDING ASSEMBLY, MICROFABRICATION APPARATUS AND METHOD OF MOUNTING DIE

摘要

A die holding assembly for, in a microfabrication apparatus capable of applying pressure to die (100) with given pattern and fabrication object (200) to thereby transfer the pattern of the die to the fabrication object (200), holding the die (100), characterized in that the die holding assembly includes die holding substratum (21) of a rigid material and elastic member (22) interposed between the die holding substratum (21) and the die (100) and formed so as to have thickness (t<SUB>1</SUB>) satisfying the formula: (1) t<SUB>1</SUB>: THICKNESS OF ELASTIC MEMBER (22), ?<SUB>1</SUB>: EXTENT OF SWELL OF AT LEAST EITHER DIE (100) OR FABRICATION OBJECT (200), a: RATIO OF "DIFFERENCE OF MAX. PRESSURE MINUS MIN. PRESSURE" TO "AVE. PRESSURE" WITHIN PLANE OF CONTACT OF DIE (100) WITH FABRICATION OBJECT (200), E<SUB>1</SUB>: YOUNG'S MODULUS OF ELASTIC MEMBER (22), AND s<SUB>1</SUB>: AVE. PRESSURE BETWEEN DIE (100) AND FABRICATION OBJECT (200).