| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an improved structure of a package side wall so that a resin member to be put in an LED light emitting device may not leak to the external surface. <P>SOLUTION: The ceramic package 10 for LED includes a substrate 18 wherein a mounting area is provided to arrange leads 12 and 14 and an LED element 16, and a side wall 22 which is open like an earthenware mortar and is provided with an inclined internal surface 20 reflecting a flux of light emitted from the LED element 16. The LED element 16 is covered with a light transmission resin member in the LED light emitting device, and the side wall 22 with the earthenware-mortar-like tapered internal surface 20 is created by ceramic processing in the same manner as the substrate 18. In this case, a projection 26 projecting from an external surface 24 (or a recessed notch step 48 on the internal surface) is provided at the upper end of the side wall 22 to prevent the resin member from leaking. <P>COPYRIGHT: (C)2008,JPO&INPIT |
