SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MOUNTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device, a manufacturing method thereof, and a manufacturing method of a mounting substrate for mounting a semiconductor component wherein the deflection of the semiconductor component can be suppressed at a low cost.

SOLUTION: The manufacturing method of a mounting substrate 30 for mounting a semiconductor component 31 has a process of applying selectively a liquid substance in a predetermined pattern onto a base material 20 having a thick-film resistor and a wiring pattern, and has a process of solidifying the applied substance to form on the base material 20 a protrusion 21A for supporting the bottom surface of the semiconductor component 31.

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