| 发明名称 |
PCB equipped with an angled lead frame |
| 摘要 |
<p>The board (1) has a three-dimensionally shaped punched grid (6) comprising multiple current paths (5) partially encapsulated by plastic and an electric or electronic component. The punched grid is of angular construction, where free end faces of the current paths of the punched grid extending over grid legs to contact the printed circuit board and the component is arranged between the current paths in a defined orientation.</p> |
| 申请公布号 |
EP1968365(A1) |
申请公布日期 |
2008.09.10 |
| 申请号 |
EP20070004735 |
申请日期 |
2007.03.08 |
| 申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
GROBEN, MANFRED;LENG, PETER |
| 分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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