| 摘要 |
PROBLEM TO BE SOLVED: To prevent a variation of contact resistance and the expansion of the end of a carbon nanotube at the time of connecting chips and connecting the chips and a substrate by a carbon nanotue bump. SOLUTION: A semiconductor device is provided with the semiconductor chip (10) and a carbon nanotube bump electrode (20) connecting the semiconductor chip to an arbitrary substrate. The carbon nanotube bump electrode is provided with the carbon nanotubes (21) and metal coating parts (25) which selectively coat one end side of the carbon nanotube. The metal coating part is connected to the semiconductor chip or the substrate. COPYRIGHT: (C)2008,JPO&INPIT |
