发明名称 LONG-SIZED LAMINATE FOR HIGH FREQUENCY CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a laminate which is a long-sized laminate formed by bonding a polyimide film and a fluorine resin, can be manufactured by bonding at a low temperature, and is excellent in adhesiveness between the polyimide film and the fluorine resin.SOLUTION: A long-sized laminate is a laminate formed by bonding a polyimide film produced using one or more aromatic diamine components selected from the group consisting of paraphenylene diamine, 1,3-bis(4-aminophenoxy)benzene, 4,4'-diaminodiphenyl ether and 3,4'-diaminodiphenyl ether, and one or more aromatic anhydride components selected from the group consisting of 4,4'-oxydiphthalic anhydride, pyromellitic dianhydride and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, and a fluorine resin. A bond strength of the polyimide film and the fluorine resin is 0.2 N/cm or more.SELECTED DRAWING: None
申请公布号 JP2016087799(A) 申请公布日期 2016.05.23
申请号 JP20140220722 申请日期 2014.10.29
申请人 DU PONT-TORAY CO LTD;DAIKIN IND LTD 发明人 SUGIYAMA MAI;OKUI MASAKAZU;KOMORI HIROKAZU;INABA TSUYOSHI
分类号 B32B27/34;B32B27/30;C08F214/18;C08G73/10;H05K1/03 主分类号 B32B27/34
代理机构 代理人
主权项
地址
您可能感兴趣的专利