| 摘要 |
The invention is a room-temperature-curable resin composition including a phosphazene skeleton-containing organosilicon compound shown by the following general formula (1). This provides a room-temperature-curable resin composition which is curable in short time, free from generation of an odor due to the catalyst, free from a heavy environmental load; and has sufficient hardness, elongation at shear, and tensile strength after curing.; |
