METHOD FOR PACKAGING OLED DEVICE, OLED DISPLAY PANEL AND OLED DISPLAY APPARATUS

摘要

Embodiments of the disclosure provide an OLED display panel, which comprises: a first substrate; a second substrate arranged opposite to the first substrate; and a thermally conductive layer, a first packaging adhesive, a second packaging adhesive and an OLED device between the first substrate and the second substrate, wherein the first packaging adhesive is arranged between the first substrate and the second substrate and encloses a sealed space with the first substrate and the second substrate; the thermally conductive layer is formed within the space enclosed by the first packaging adhesive and includes at least two regions having different conductivities, wherein at least an edge region of the thermally conductive layer has a higher conductivity than a central region of the thermally conductive layer; the second packaging adhesive fills the space enclosed by the first substrate, the second substrate and the first packaging adhesive, and is in contact with a surface of the thermally conductive layer. The disclosure further provides an OLED display apparatus and a method for packaging an OLED device.

主权项

1. An OLED display panel, comprising:
a first substrate; a second substrate arranged opposite to the first substrate; and a thermally conductive layer, a first packaging adhesive, a second packaging adhesive and an OLED device between the first substrate and the second substrate, wherein the first packaging adhesive is arranged between the first substrate and the second substrate and encloses a sealed space with the first substrate and the second substrate, the thermally conductive layer is formed within the space enclosed by the first packaging adhesive and includes at least two regions having different conductivities, wherein at least an edge region of the thermally conductive layer has a higher conductivity than a central region of the thermally conductive layer, the second packaging adhesive fills the space enclosed by the first substrate, the second substrate and the first packaging adhesive, and is in contact with a surface of the thermally conductive layer.