| 发明名称 |
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR JOINING ELECTRONIC PART |
| 摘要 |
A joining silver sheet with high joining strength contains silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and has a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of from TA to TB (° C.) satisfying 270 £ TA<TB £ 350. A method of making the silver sheet includes subjecting a coated film of a silver paste containing silver powder containing silver particles having a particle diameter of from 1 to 250 nm, and a dispersion medium that undergoes volatilization in a temperature range of 200° C. or lower, which are mixed with each other, to a heat treatment at a temperature range, at which no sintering occurs, and then baking at a temperature of from 170 to 250° C. under application of a pressure of from 5 to 35 MPa. |
| 申请公布号 |
US2016254243(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201415028453 |
申请日期 |
2014.10.06 |
| 申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
KURITA Satoru;ENDOH Keiichi;MIYOSHI Hiromasa |
| 分类号 |
H01L23/00;B23K35/30;B22F5/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A joining silver sheet comprising silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and having a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of “TA (° C.) or higher and TB (° C.) or lower” satisfying the following expression (1):
270≦TA<TB≦350 (1) |
| 地址 |
Tokyo JP |
