LOW WARPING CORELESS SUBSTRATE AND SEMICONDUCTOR ASSEMBLY USING THE SAME

摘要

A coreless substrate includes a build-up circuitry, a warping controller and an optional stiffener. The warping controller is adhered to the solder ball attachment side of the build-up circuitry and provides mechanical support for the coreless substrate, whereas the optional stiffener is positioned around peripheral edges of the coreless substrate at the chip attachment side of the build-up circuitry and provides mechanical support for the peripheral area of the coreless substrate.

主权项

1. A low warping coreless substrate, comprising:
a build-up circuitry having a top side, an opposite bottom side, bond pads at the top side, and contact pads at the bottom side, wherein the contact pads are electrically coupled to the bond pads; and an anti-warping controller that is disposed under the bottom side of the build-up circuitry.