| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet peeling device and a peeling method capable of reliably peeling an adhesive sheet from an adherend such as a wafer.SOLUTION: A sheet peeling device 1 is provided with vibration applying means 6 that makes a slider 3I vibrate a chuck cylinder 3K. As a result, by vibrating the chuck cylinder 3K, this vibration can be transmitted, via a peeling tape PT held by a holding pawl 3J and an adhesive sheet AS to which the peeling tape PT is adhered, to a peeling off part AS1 where peeling-off between the adhesive sheet AS and a wafer WF occurs. Therefore, even when the peeling force between the adhesive sheet AS and the wafer WF is large, the peeling force of the adhesive sheet AS can be reliably reduced by the vibration and the adhesive sheet AS can be reliably peeled off from the wafer WF. |
