| 摘要 |
To improve heat dissipation performance relating to heat generated when outputting light emitted from a light emitting element. The present invention is provided with: a light emitting element 26 that functions as a light source; a wiring pattern on which the light emitting element is mounted; an electrode pad 29 connected to the wiring pattern; a substrate 25, on which the wiring pattern is formed, and the electrode pad is mounted; a power supply body 10 that supplies external power to the electrode pad; and a socket housing 9, which has an engaging section 20 engaged with a predetermined member, and which holds the substrate, the light emitting element, and the power supply body. The power supply body has a terminal holding section 21 formed of an insulating resin material, and a connecting terminal 22, which is held by means of the terminal holding section, and is connected to an external power supply, and the connecting terminal and the electrode pad are connected to each other by a conducting connecting section 31. |
