| 发明名称 |
ACOUSTIC DEVICE PACKAGE AND METHOD OF MAKING |
| 摘要 |
An assembly including an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa, an acoustic device die having opposite end portions mounted on and electrically connected to the electrical connection substrate and a mold compound layer encapsulating the acoustic device die and interfacing with the substrate. |
| 申请公布号 |
US2016322557(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
US201514698616 |
申请日期 |
2015.04.28 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Tuncer Enis;Castro Abram |
| 分类号 |
H01L41/08;H03H3/007 |
主分类号 |
H01L41/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An assembly comprising:
an electrical connection substrate formed of material having a Young's modulus of less than about 10 MPa; an acoustic device die having a mid portion and opposite end portions mounted on and electrically coupled to said electrical connection substrate; and a mold compound layer encapsulating said acoustic device die and interfacing with said substrate. |
| 地址 |
Dallas TX US |
