| 摘要 |
PURPOSE:To obtain a semiconductor device, wherein there is not the deformation of the point parts of inner leads and the yield of a wire bonding is good and which is a highly reliable semiconductor device. CONSTITUTION:The point parts of inner leads 7 are respectively fixed on die pads 3 by a support tape 12 and a resin sealing is performed. Accordingly, the deformation of the point parts of the leads 7, which is caused by the flow of a resin at the time of the resin sealing or the like, can be prevented from being generated and problems that the adjacent inner leads 7 come into contact to each other and the wires are separated from the leads 7 or other problems are not generated. |
