| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit module which prevents short circuits between electrodes of a chip component. SOLUTION: In the electronic circuit module wherein the chip component 3 is soldered on a circuit board 1, a resin member 8 and the surface reforming material file 7 are more firmly attached to each other by the existence of the surface reforming material film 7 formed on the outer surface of the chip component 3. Even if a solder 6 for connecting lands 2 and electrodes 5 melts, the resin member 8 is never peeled off from the material 7 by the molten solder 6, preventing short circuits between the electrodes 5 of the chip component 3. COPYRIGHT: (C)2007,JPO&INPIT
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