| 摘要 |
PROBLEM TO BE SOLVED: To provide an electric connection structure of a semiconductor device capable of bonding two substrates without a gap, and certainly securing electric connection at electric connection parts of both of the substrates. SOLUTION: A movable substrate 13 is elastically supported above a base part 12 by bonding two bond parts of anchor parts 124a, 124b by anodic bonding to an upper surface of a fixed substrate 101. A junction electrode 127 provided on a step part 129 of the anchor part 124a and a junction electrode 111 provided on a fixed electrode 106 are press-contact with each other and are electrically connected. Furthermore, a slit groove 130 is formed between the bond part of the anchor part 124a and the step part 129, and the anchor part 124a is deformed in a position of the slit groove 130 to relax stress. COPYRIGHT: (C)2007,JPO&INPIT
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