发明名称 |
Programmable Via Structure for Three Dimensional Integration Technology |
摘要 |
A programmable link structure for use in three dimensional integration (3DI) semiconductor devices includes a via filled at least in part with a phase change material (PCM) and a heating device proximate the PCM. The heating device is configured to switch the conductivity of a transformable portion of the PCM between a lower resistance crystalline state and a higher resistance amorphous state. Thereby, the via defines a programmable link between an input connection located at one end thereof and an output connection located at another end thereof
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申请公布号 |
US2009072213(A1) |
申请公布日期 |
2009.03.19 |
申请号 |
US20080178921 |
申请日期 |
2008.07.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ELMEGREEN BRUCE G.;KRUSIN-ELBAUM LIA;LAM CHUNG HON;NEWNS DENNIS M.;WORDEMAN MATTHEW R.;YOUNG ALBERT M. |
分类号 |
H01L47/00 |
主分类号 |
H01L47/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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