| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor module and a manufacturing method thereof with which it is possible to arrange a sensor chip, an IC chip, and a chip component with better space efficiency.SOLUTION: A molding 2 in which terminal boards 3, 4 are partially buried is formed by injection molding. A first recess 5 and a second recess 6 are formed in the molding 2, with a pressure sensor chip 12 accommodated in the first recess 5 and connected to the terminal boards 3, 4 by a bonding wire 13, with an IC chip 14 accommodated in the second recess 6 and connected by a bonding wire 15. The molding 2 is provided with a boundary wall 2c for dividing the first recess 5 and the second recess 6, with chip components 11, 11 buried in the boundary wall 2c.SELECTED DRAWING: Figure 1 |
