| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized resistance heating furnace of a small-sized manufacturing device which performs large-item and small-volume production of devices at low cost by using a processing wafer with a small diameter.SOLUTION: In a small-sized resistance heating furnace 100, a heating chamber 110 and a device front chamber 120 are disposed within a housing 101, and a container placement table 121 for placing a wafer transfer container 130 thereon is provided in the housing 101. When heating a processing wafer 131, a processing wafer 131 is transferred from the container placement table 121 through the device front chamber 120 to the heating chamber 110 and, after heating, returned to the container placement table 121 and carried out. The heating chamber 110 comprises: a heating part 20 including a heater 21 capable of heating one inserted processing wafer 131; and an insertion part 30 which can be inserted from a lower side into the heating part 20. The insertion part 30 includes a holding part 31 capable of holding the processing wafer 131 and in the state where the processing wafer 130 is held by the holding part 31, the processing wafer is inserted into the heating part 20 by moving the insertion part 30 upwards and heated.SELECTED DRAWING: Figure 4 |
