发明名称 |
Chemically amplified photosensitive resin composition and method for producing resist pattern using the same |
摘要 |
A chemically amplified photosensitive resin composition including a compound represented by formula (1) and/or formula (4), a resin having an acid-dissociative dissolution-controlling group whose solubility in alkali increases under the action of an acid or an alkali-soluble resin, a photoacid generator, and an organic solvent, in which the solid concentration is 40% by mass to 65% by mass. R1, R2, and R3 independently represent a hydrogen atom or an alkyl group, R4 represents a group represented by formula (2) or (3), and R5 and R6 represent a monovalent hydrocarbon group which may have a substituent.; |
申请公布号 |
US9372403(B2) |
申请公布日期 |
2016.06.21 |
申请号 |
US201414451112 |
申请日期 |
2014.08.04 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
Irie Makiko;Katayama Shota |
分类号 |
G03F7/039;G03F7/20;G03F7/30;G03F7/027 |
主分类号 |
G03F7/039 |
代理机构 |
Knobbe Martens Olson & Bear LLP |
代理人 |
Knobbe Martens Olson & Bear LLP |
主权项 |
1. A chemically amplified photosensitive resin composition, comprising:
a compound represented by the following formula (4):wherein, R5 and R6 represent a monovalent hydrocarbon group which may have a substituent;
a resin having an acid-dissociative dissolution-controlling group and whose solubility in alkali increases under the action of an acid; a photoacid generator; and an organic solvent, wherein a solid concentration is 40% by mass to 65% by mass. |
地址 |
Kawasaki-Shi JP |