发明名称 Chemically amplified photosensitive resin composition and method for producing resist pattern using the same
摘要 A chemically amplified photosensitive resin composition including a compound represented by formula (1) and/or formula (4), a resin having an acid-dissociative dissolution-controlling group whose solubility in alkali increases under the action of an acid or an alkali-soluble resin, a photoacid generator, and an organic solvent, in which the solid concentration is 40% by mass to 65% by mass. R1, R2, and R3 independently represent a hydrogen atom or an alkyl group, R4 represents a group represented by formula (2) or (3), and R5 and R6 represent a monovalent hydrocarbon group which may have a substituent.;
申请公布号 US9372403(B2) 申请公布日期 2016.06.21
申请号 US201414451112 申请日期 2014.08.04
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 Irie Makiko;Katayama Shota
分类号 G03F7/039;G03F7/20;G03F7/30;G03F7/027 主分类号 G03F7/039
代理机构 Knobbe Martens Olson & Bear LLP 代理人 Knobbe Martens Olson & Bear LLP
主权项 1. A chemically amplified photosensitive resin composition, comprising: a compound represented by the following formula (4):wherein, R5 and R6 represent a monovalent hydrocarbon group which may have a substituent; a resin having an acid-dissociative dissolution-controlling group and whose solubility in alkali increases under the action of an acid; a photoacid generator; and an organic solvent, wherein a solid concentration is 40% by mass to 65% by mass.
地址 Kawasaki-Shi JP