发明名称 SUBSTRATE CHUCK, SUBSTRATE BONDING APPARATUS
摘要 PURPOSE: A substrate chuck and a glass laminating apparatus for adhering to a substrate by using adhesion are provided to improve the fabrication efficiency and utilization ratio by easily performing maintenance and manufacturing the substrate at low cost. CONSTITUTION: A table is installed in a chamber. A base plate(310) is installed in the table. An adhesive(320) is installed in the base plate. A substrate separation unit(330) is around the adhesive. The substrate is protruded to the outside of the base plate in order to separate the substrate from the adhesive. The substrate separation is restored after the separation of substrate by the base plate.
申请公布号 KR20090125398(A) 申请公布日期 2009.12.07
申请号 KR20080051493 申请日期 2008.06.02
申请人 ADP ENGINEERING CO., LTD. 发明人 HWANG, JAE SEOK
分类号 G02F1/13;H01L21/20;H01L21/687 主分类号 G02F1/13
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