| 摘要 |
The present invention provides an apparatus for treating a substrate and a shaft assembly. The apparatus for treating a substrate includes a chamber providing a processing space therein and having one side surface formed with a through-hole; a transferring unit transferring a substrate from the processing space in a first direction; and a cleaning unit cleaning the substrate supported by the transferring unit. The cleaning unit includes a solution supply unit supplying cleaning solution to the substrate supported by the transferring unit, and a brush unit cleaning the substrate through a physical contact. The brush unit includes a support shaft passing through the through-hole to be placed in the processing space, a brush driving member rotating the support shaft, a brush installed to surround the support shaft to be rotated with the support shaft and capable of coming in physical contact with the substrate, and a blocking member installed on the support shaft on the outside of bristles of the brush to prevent processing solution from being discharged to the outside of the chamber along the support shaft. The blocking member has a guide part having a first inner diameter gradually enlarged toward the bristles of the brush. Therefore, the cleaning solution may be prevented from being introduced into a driving member connected to the support shaft. |
