| 摘要 |
A wafer carrier tray 4 is integrally formed of a ceramic material having a bore 40, a coupling surface 41, and a carrying surface 42, the bore 40 is formed in a centre for receiving an electrostatic chuck (50 fig. 5) of a machine (5 fig. 5), the coupling surface 41 is formed on the bottom for coupling to the machine (5 fig. 5), the carrying surface 42 is formed on the top and has a plurality of equally spaced carrier blocks 44 arranged at locations adjacent to the bore 40, each including a support face 45 located on a top and slanting downwards from outside to inside for supporting a wafer (6 fig. 5), two side faces 46 located on opposite sides slanting toward each other from outside to inside and top edges that are connected to two opposite side edges of the support face 45. The tray 4 may be a circular ring. The coupling surface 41 may include a groove (43 fig. 5) to receive a ceramic insulator of the machine (5 fig. 5). Each carrier block 44 may be a quadrangular pyramid with its apex oriented towards and spaced from the bore 40. |
