发明名称 セラミック電子部品
摘要 PROBLEM TO BE SOLVED: To provide a ceramic electronic component having a mounting structure for a metal terminal and a chip component, which is highly reliable and easy to manufacture.SOLUTION: The ceramic electronic component includes: a chip component 20; a first metal terminal 30 including a first flat plate part 38 facing a first end face, at least one pair of first fitting arm parts 31a on which first engagement projections engaging with first wraparound parts of a first terminal electrode are formed and which sandwich the first wraparound parts therebetween to grip them, and a first mounting part 39 which is connected to the first flat plate part and extends; and a second metal terminal 40 including a second flat plate part facing a second end face, at least one pair of second fitting arm parts on which second engagement projections engaging with second wraparound parts of a second terminal electrode are formed and which sandwich the second wraparound parts therebetween to grip them, and a second mounting part which is connected to the second flat plate part and extends.
申请公布号 JP5983930(B2) 申请公布日期 2016.09.06
申请号 JP20120184853 申请日期 2012.08.24
申请人 TDK株式会社 发明人 増田 淳;小林 一三;吉井 彰敏
分类号 H01G4/232;H01G4/248;H01G4/30;H01G4/38 主分类号 H01G4/232
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